november 2009 doc id 15673 rev 2 1/10 10 EMIF08-LCD04M16 8-line l-c ipad?, emi filter an d esd protection in micro qfn features high cut off frequency low-pass filter: f c = 400 mhz at -6 db high efficiency in emi filtering: better than -35 db from 900 mhz to 2 ghz very low pcb space consuming with plastic micro-package 3.3 x 1.35 mm very thin package: 0.55 mm high efficiency in esd (iec 61000-4-2 level 4) high reliability offered by monolithic integration high reducing of parasitic elements through integration ecopack ? 2 compliant component complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where emi filtering in es d sensitive equipment is required: l c d a n d c a m e r a f o r m o b i l e p h o n e s computers and printers communication systems mcu boards figure 1. device configuration description the EMIF08-LCD04M16 is a 8-line inductor- capacitor (lc) emi filter designed to suppress emi/rfi noise in all systems subjected to electromagnetic interferences requiring a large bandwidth. this filter includes an esd protection circuitry, which prevents damage to the application when subjected to esd surges up 15 kv contact discharge. tm : ipad is a trademark of stmicroelectronics. micro qfn 3.3 x 1.35 16l input gnd gnd gnd output low-pass filter 0 0 0 0 www.st.com
electrical characteristics EMIF08-LCD04M16 2/10 doc id 15673 rev 2 1 electrical characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, contact discharge 15 kv t op operating temperature range -40 to 85 c t j maximum junction temperature 125 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 - - v i rm v rm = 3 v per line - - 100 na l inductance - 12 - nh c line v r = 3 v dc, f = 1 mhz, v osc = 30 mv 17 18 19 pf r parasitic resistance of the inductance 9 12.5 20 f c 50 source and 50 load termination at -6 db - 400 - mhz v cl v br v rm i rm i r i pp i i f v v cl v br v rm i rm i r i pp i i f v symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage r = dynamic impedance i = peak pulse current i = breakdown current t = voltage temperature coefficient v = forward voltage drop br rm rm rm cl d pp r f
EMIF08-LCD04M16 electrical characteristics doc id 15673 rev 2 3/10 figure 7. line capacitance versus applied voltage figure 3. s21 attenuation measurements figure 4. analog crosstalk measurements -70 -65 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 db 100k 1m 10m 100m 1g i2 - o2 #1 i3 o3 #1 i4 o4 #1 i5 o5 #1 i6 - o6 #1 i7 - o7 #1 i8 - o8 #1 - - - f/hz f/hz figure 5. esd response to iec 61000-4-2 (+15 kv air discharge) figure 6. esd response to iec 61000-4-2 (-15 kv air discharge) in out c2 c3 5v/div 2v/div in out c2 c3 5v/div 2v/div 0 5 10 15 20 25 30 35 012345 v (v) r c(pf)
ordering information scheme EMIF08-LCD04M16 4/10 doc id 15673 rev 2 2 ordering information scheme figure 8. ordering information scheme emif yy - xxxzz mxx emi filter n u m b er of line s inform a tion p a ck a ge xxx = a pplic a tion zz = ver s ion mxx = micro qfn - xx le a d s
EMIF08-LCD04M16 package information doc id 15673 rev 2 5/10 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. micro qfn 3.3x1.35 16l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d - 3.30 - - 0.13 - d2 2.65 2.80 2.90 0.104 0.110 0.114 e - 1.35 - - 0.053 - e2 0.25 0.40 0.50 0.010 0.016 0.020 e - 0.40 - - 0.016 - k 0.20 - - 0.008 - - l 0.15 0.25 0.35 0.006 0.010 0.014 figure 9. footprint figure 10. marking d index area (d/2 x e/2) top view side view bottom view e a e d2 l b k e2 a1 index area (d/2 x e/2) exposed pad pin # 1 id 1 8 9 16 0.40 0.45 0.40 0.20 2.80 3.00 0.85 1.75 xx ww y p dot: pin 1 xx: marking ww: assembly week y: assembly year p: assembly plant
recommendation on pcb assembly EMIF08-LCD04M16 6/10 doc id 15673 rev 2 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 11. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 12. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 200 m 450 m 422 m 192 m 14 m 14 m 4m 4m 2800 m 400 m 2000 m 280 m 400 m 400 m 60 m 60 m footprint stencil window footprint t=100 m
EMIF08-LCD04M16 recommendation on pcb assembly doc id 15673 rev 2 7/10 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly EMIF08-LCD04M16 8/10 doc id 15673 rev 2 4.5 reflow profile figure 13. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
EMIF08-LCD04M16 ordering information doc id 15673 rev 2 9/10 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF08-LCD04M16 ja (1) 1. the marking can be rotated by 90 to differentiate assembly location qfn 6.74 mg 3000 tape and reel table 5. document revision history date revision changes 20-may-2009 1 initial release. 10-nov-2009 2 updated features on page 1 . added figure 2 on page 2 .
EMIF08-LCD04M16 10/10 doc id 15673 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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